{"id":36783,"date":"2025-08-13T12:04:13","date_gmt":"2025-08-13T10:04:13","guid":{"rendered":"https:\/\/www.hilase.cz\/?post_type=projekty&#038;p=36783"},"modified":"2025-09-08T14:58:25","modified_gmt":"2025-09-08T12:58:25","slug":"lapsic","status":"publish","type":"projekty","link":"https:\/\/www.hilase.cz\/en\/projekty\/lapsic\/","title":{"rendered":"LaPSiC &#8211; Laser grinding of silicon carbide for high-power semiconductor applications"},"content":{"rendered":"","protected":false},"author":10,"template":"","class_list":["post-36783","projekty","type-projekty","status-publish","hentry","projekty-kategorie-international-en"],"acf":{"obrazek":{"ID":34379,"id":34379,"title":"Thumbnails (68)","filename":"Thumbnails-68.png","filesize":132930,"url":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68.png","link":"https:\/\/www.hilase.cz\/en\/thumbnails-68\/","alt":"","author":"15","description":"","caption":"","name":"thumbnails-68","status":"inherit","uploaded_to":0,"date":"2025-01-28 09:51:58","modified":"2025-01-28 09:51:58","menu_order":0,"mime_type":"image\/png","type":"image","subtype":"png","icon":"https:\/\/www.hilase.cz\/wp-includes\/images\/media\/default.png","width":314,"height":166,"sizes":{"thumbnail":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68-175x166.png","thumbnail-width":175,"thumbnail-height":166,"medium":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68.png","medium-width":314,"medium-height":166,"medium_large":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68.png","medium_large-width":314,"medium_large-height":166,"large":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68.png","large-width":314,"large-height":166,"1536x1536":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68.png","1536x1536-width":314,"1536x1536-height":166,"2048x2048":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68.png","2048x2048-width":314,"2048x2048-height":166,"image":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68.png","image-width":314,"image-height":166,"gallery":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68-273x166.png","gallery-width":273,"gallery-height":166,"card":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68.png","card-width":314,"card-height":166,"square":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Thumbnails-68.png","square-width":314,"square-height":166}},"datum_od":"2025-01-01","datum_do":"2027-12-31","obsah":[{"acf_fc_layout":"text","text":"<p data-start=\"109\" data-end=\"417\">Silicon carbide (SiC) semiconductors can withstand up to ten times higher electric field than conventional silicon devices, operate at higher temperatures, and support high current densities \u2013 all while reducing chip size by up to 90 %. This makes them indispensable for next-generation power electronics.<\/p>\n<p data-start=\"419\" data-end=\"817\">One critical step in SiC device fabrication is wafer thinning, essential for quality control, cost efficiency, and market competitiveness. Conventional diamond wheel grinding suffers from low material removal rates and significant tool wear. Lasers offer a promising \u2013 and in some cases the only \u2013 alternative, enabling faster processing, reduced wafer warpage, and potentially higher yields.<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/www.hilase.cz\/wp-content\/uploads\/Laser-grinding-of-silicon-carbide-for-high-power-semiconductor-applications.png\" \/><\/p>\n<h6 data-start=\"1484\" data-end=\"1505\"><strong data-start=\"1488\" data-end=\"1505\">Project Goals<\/strong><\/h6>\n<p>The aim of the project is to develop a high-performance laser grinding system for SiC wafers, integrating:<\/p>\n<ul>\n<li data-start=\"1619\" data-end=\"1666\">A <strong data-start=\"1621\" data-end=\"1664\">customized high-power solid-state laser<\/strong><\/li>\n<li data-start=\"1619\" data-end=\"1666\">Optimized <strong data-start=\"1679\" data-end=\"1701\">process parameters<\/strong> (wavelength, pulse width, energy per pulse, repetition rate)<\/li>\n<li data-start=\"1619\" data-end=\"1666\">A <strong data-start=\"1769\" data-end=\"1795\">laser grinding machine<\/strong> with integrated optoelectronics<\/li>\n<li data-start=\"1619\" data-end=\"1666\"><strong data-start=\"1832\" data-end=\"1870\">Qualified semiconductor processing<\/strong> protocols<\/li>\n<\/ul>\n<h6 data-start=\"209\" data-end=\"232\"><strong data-start=\"209\" data-end=\"230\">Project partners:<\/strong><\/h6>\n<ul>\n<li data-start=\"235\" data-end=\"309\"><strong data-start=\"235\" data-end=\"252\">HiLASE Centre<\/strong> (<a href=\"http:\/\/www.fzu.cz\">FZU<\/a>) \u2013 Laser development and customization (Czech Republic)<\/li>\n<li data-start=\"312\" data-end=\"398\"><a href=\"https:\/\/kariera-onsemi.cz\/\"><strong data-start=\"312\" data-end=\"322\">onsemi<\/strong><\/a> \u2013 Semiconductor device manufacturing and quality control (Czech Republic)<\/li>\n<li data-start=\"401\" data-end=\"488\"><a href=\"https:\/\/idesyn.com\/\"><strong data-start=\"401\" data-end=\"412\">iDensyn<\/strong><\/a> \u2013 Integrated device manufacturing for the semiconductor industry (Taiwan)<\/li>\n<li data-start=\"491\" data-end=\"563\"><a href=\"http:\/\/www.deuvtek.com\"><strong data-start=\"491\" data-end=\"502\">DEUVtek<\/strong><\/a> \u2013 Industrial machines for laser processing of SiC (Taiwan)<\/li>\n<\/ul>\n<p data-start=\"565\" data-end=\"620\"><strong data-start=\"565\" data-end=\"579\">Programme:<\/strong> <a href=\"http:\/\/Technology Agency of the Czech Republic\">Technology Agency of the Czech Republic<\/a>: Taiwan\u2013Czech Bilateral SIGMA Programme (Co-funding R&amp;D Project)<br \/>\nProject number: TQ16000033<\/p>\n<h6 data-start=\"2489\" data-end=\"2514\"><strong data-start=\"2493\" data-end=\"2514\">Expected Outcomes<\/strong><\/h6>\n<ul>\n<li data-start=\"2518\" data-end=\"2587\"><strong data-start=\"2518\" data-end=\"2545\">Laser-ground SiC wafers<\/strong> for semiconductor applications<\/li>\n<li data-start=\"2591\" data-end=\"2666\"><strong data-start=\"2591\" data-end=\"2630\">Qualified laser grinding technology<\/strong> for SiC wafer processing<\/li>\n<li data-start=\"2670\" data-end=\"2743\"><strong data-start=\"2670\" data-end=\"2707\">High-power thin-disk laser system<\/strong> tailored to SiC grinding<\/li>\n<li data-start=\"2747\" data-end=\"2831\"><strong data-start=\"2747\" data-end=\"2777\">Integrated grinding system<\/strong> for SiC wafer production<\/li>\n<\/ul>\n<p>This collaboration between Taiwanese and Czech partners will deliver an <strong data-start=\"2925\" data-end=\"2993\">innovative, cost-effective, and efficient manufacturing solution<\/strong> for the semiconductor industry. Beyond SiC wafer grinding, the developed laser platform can be adapted for other demanding materials \u2013 from plastics and glass to composites and metals.<\/p>\n","oddelovace":"bottom"},{"acf_fc_layout":"galerie","galerie":[{"ID":22749,"id":22749,"title":"Hilase-273x210","filename":"Hilase-273x210-1.png","filesize":9266,"url":"https:\/\/www.hilase.cz\/wp-content\/uploads\/Hilase-273x210-1.png","link":"https:\/\/www.hilase.cz\/projekty\/hilase-centre-of-excellence\/hilase-273x210\/","alt":"","author":"15","description":"","caption":"","name":"hilase-273x210","status":"inherit","uploaded_to":6212,"date":"2022-09-21 09:19:07","modified":"2022-09-21 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