HiLASE Centre took part in Czech Space Week 2025, the key national platform bringing together academia, industry, and public institutions shaping the future of the Czech space ecosystem. Our involvement highlighted HiLASE’s growing role in space-oriented laser technologies, international collaboration, and technology transfer from research to real-world applications.
As part of the accompanying Space2Business programme, Jan Vanda, Deputy Leader of Space Laser Technologies at HiLASE, joined a panel discussion focused on strengthening collaboration between academic research and industrial partners. The discussion addressed some of the central challenges of the space sector, including bridging the gap between fundamental research and flight-ready technologies, overcoming the so-called “valley of death,” and the importance of shared infrastructure and long-term partnerships in accelerating innovation.
The panel brought together representatives from leading Czech academic and industrial institutions, reinforcing the Czech Republic’s position as a country with an exceptionally dense and dynamic space research landscape.
HiLASE Centre was further represented at Czech Space Week by Prof. Massimiliano Vasile, Leader of Space Laser Technologies, and Radek Pobořil, postdoctoral researcher in the same group, underlining the Centre’s strong scientific presence across multiple levels of expertise.
Beyond the conference programme, HiLASE welcomed three international delegations from the space sector during the week. Visiting representatives from the United Arab Emirates, Ukraine, Turkey, and South Korea explored HiLASE’s laser infrastructure, research capabilities, and potential avenues for future cooperation in space-related applications.
HiLASE’s participation in Czech Space Week and Space2Business reflects its long-term commitment to advancing laser technologies for space, fostering international collaboration, and contributing to the Czech Republic’s ambition to translate cutting-edge research into impactful space solutions.
