Silicon carbide (SiC) semiconductors can withstand up to ten times higher voltages than conventional silicon devices, operate at higher temperatures, and support high-intensity current levels – all while reducing chip size by up to 90 %. This makes them indispensable for next-generation power electronics.
One critical step in SiC device fabrication is wafer thinning, essential for quality control, cost efficiency, and market competitiveness. Conventional diamond wheel grinding suffers from low material removal rates and significant tool wear. Lasers offer a promising – and in some cases the only – alternative, enabling faster processing, reduced wafer warpage, and potentially higher yields.
Project Goals
The aim of the project is to develop a high-performance laser grinding system for SiC wafers, integrating:
- A customized high-power solid-state laser
- Optimized process parameters (wavelength, pulse width, energy per pulse, repetition rate)
- A laser grinding machine with integrated optoelectronics
- Qualified semiconductor processing protocols
Project partners:
- HiLASE Centre (FZU) – Laser development and customization (Czech Republic)
- onsemi – Semiconductor device manufacturing and quality control (Czech Republic)
- iDensyn – Integrated device manufacturing for the semiconductor industry (Taiwan)
- DEUVtek – Industrial machines for laser processing of SiC (Taiwan)
Programme: Technology Agency of the Czech Republic: Taiwan–Czech Bilateral SIGMA Programme (Co-funding R&D Project)
Project number: TQ16000033
Expected Outcomes
- Laser-ground SiC wafers for semiconductor applications
- Qualified laser grinding technology for SiC wafer processing
- High-power thin-disk laser system tailored to SiC grinding
- Integrated grinding system for SiC wafer production
This collaboration between Taiwanese and Czech partners will deliver an innovative, cost-effective, and efficient manufacturing solution for the semiconductor industry. Beyond SiC wafer grinding, the developed laser platform can be adapted for other demanding materials – from plastics and glass to composites and metals.
