HiLASE CENTRE at Tech resilience & Innovation forum held on TaiwanCZ High-Tech Level Up 2021

The important Taiwanese delegation of ministers, their deputies, and business leaders visited Prague (25-26 October 2021). The delegation was led by the Minister of the National Development Council, Ming-hsin Kung, and the Minister of Science and Technology, Tsung-tsong Wu. It consisted of representatives from the government, prominent Taiwanese companies, and research institutes such as the Industrial Technology Research Institute (ITRI), the National Space Organization, and the Asia Silicon Valley Development Agency. Among the companies represented will be chipmaker SEMI – an association of semiconductor companies. This was definitely the largest business visit in the history of both countries.

We are proud that Tomáš Mocek, Head of HiLASE Centre had the opportunity to introduce portfolio our services, laser technologies, activities and possible ways of cooperation to the delegates in a part of program Tech resilience & Innovation forum focused on Semiconductors.

The forum´s key was to explore new cooperation areas between the Czech Republic and Taiwan that could trigger innovation, secure supply chains, support tech resilience and outline a new roadmap for Taiwan and the Czech Republic.

For more information please visit https://taiwanbiz.cz/


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