Meet HiLASIANS at the Intech fair! Jan Brajer, head of the Industrial Laser Applications department, and Petr Hauschwitz, laser micromachining team leader, will be attending on the 23rd and 24th of March.
If you’d like to find out more about HiLASE Centre’s products and services, especially in laser applications for industry, such as Laser Shock Peening (LSP) or Laser Micromachining (LMM), arrange to meet with them. They would happily talk to you about possible collaborations, or current trends in laser applications.
LSP is a method which can be used in many different areas of industry to extend the lifespan of metal components, mainly those which are under repeated stress. The HiLASE Centre R&D team has two LSP stations available to it, offering a wide array of services ranging from the assessment of LSP suitability for a concrete case, to the implementation into the manufacturing process.
Laser micromachining can be used to improve the functionality of products through drilling of micrometre holes, precise cutting, or surface structuring. This process, which can substantially simplify manufacturing processes, can be useful in aerospace, automotive, food and pharmaceutical production, power and energy, tooling, the biomedical field, and more.
The Intech fair, organised by TRUMPF, which takes place in Ditzingen, Germany, from the 21st to the 24th of March, is focused on lasers, sensors, optics, and other related areas. Its goal is, among other things, to support manufacturing sustainability and reduce carbon footprint.